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Gold-Tin (Au/Sn) is the most widely used solder material for optical device packaging. Fionix offers Au/Sn solder bumping service by using vacuum deposition technique. The advantages of vacuum deposition are precise control of both thickness and composition. Deposition methods include co-deposition of Gold and Tin, Au-Sn alloy deposition, and Gold and Tin multi-layer deposition. Fionix also provides consulting service for UBM and Au-Sn solder system design. |
