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Fionix provides very unique 45 degree silicon micro mirrors. Ordinary anisotropic wet etching of commercially available silicon (100) wafers produces 54.7 degree sidewall defined by {111} crystallographic planes. The 45 degree reflective surfaces are defined by {110} planes of Si (100) wafers. However, anisotropic etch rate ratio of R(110)/R(100) for both pure KOH and TMAH solution is greater than 1, so it is hard to fabricate {110} surface from silicon (100) wafer. The etch rate ratio of R(110)/R(100) can be inversed and therefore can make 45 degree sidewalls by special additives in both KOH and TMAH solutions. Fionix provides near 45 degree silicon micro mirrors having nm order smoothness. |
